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MICRO DEGREE

High-Speed PCB Design Engineer

Become a Certified High-Speed PCB Design Engineer

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Become a Certified High-Speed PCB Design Engineer

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Application closes on:21 Jun 2026
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What is in it for you?

Dive into the world of high-speed PCB design and become an expert in tackling complex signal integrity, power integrity, and EMI challenges. Through hands-on projects and industry-experienced mentors, you'll master the latest design techniques, simulation tools, and validation workflows to create reliable, high-performance electronics for cutting-edge applications.
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100% Live Classes 100% Live Classes

Instructor-led Live Sessions Instructor-led Live Sessions

Attend 4 weeks of instructor led live classes from the top 1% industry experts

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Projects & Case Studies

Projects & Case Studies

Projects & Case Studies

Gain hands-on experience with projects and real-world case studies for impactful learning.

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Verified Certificate

Verified Certificate

Verified Certificate

Earn a industry recognized certificate and kick start your career

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Session Recordings

Session Recordings

Session Recordings

Revisit older chapters anytime with recorded sessions

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Flexible Schedule

Flexible Schedule

Flexible Schedule

Choose live classes from different cohorts that fit your availability.

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Hands-on Classes

Hands-on Classes

Hands-on Classes

Hands-on classes to enhance your learning experience

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$1998.00$779.00
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$1998.00$779.00
limited time offer61% OFF

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2

Basic Info

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Application closes on:21 Jun 2026
Get instant access of pre-course material!

Full Name*
Email*
WhatsApp Number*
Checkbox EdYoda

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money back guarantee100% Moneyback Guarantee

Available in 4 monthly installments at $195/month

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High-Speed PCB Design Engineer
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money back guarantee100% Moneyback Guarantee

Available in 4 monthly installments at $195/month

Reserve your spot today!

Full Name*
Email*
WhatsApp Number*
Checkbox EdYoda

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money back guarantee100% Moneyback Guarantee

Curriculum

Duration: 6 weeks
Max Batch Size: 15 persons
Live Sessions Schedule
dateSat - Sun (Weekends Only) timeTiming 7:00 AM - 9:00 AM / 8:30 AM - 10:30 AM / 11:00 AM - 1:00 PM / 5:00 PM - 7:00 PM / 7:30 PM - 9:30 PM EST

1. Introduction to High-Speed PCB DesignDownArrow
Sub-topics Covered
  • Evolution of high-speed digital systems and PCB requirements
  • Differences between standard and high-speed board design
  • Understanding signal integrity, timing, and noise challenges
  • Overview of design flow: schematic to layout to validation
  • Tools used in high-speed design (Altium, Cadence, KiCad, HyperLynx)
  • Industry applications: computing, networking, automotive, and AI hardware
2. Signal Integrity FundamentalsDownArrow
Sub-topics Covered
  • Transmission line theory and wave propagation
  • Reflections, crosstalk, and ringing in high-speed traces
  • Impedance control and differential pair concepts
  • Termination techniques and signal damping strategies
  • Eye diagrams, timing windows, and jitter analysis
  • Simulating signal integrity using SI tools and models
3. Stack-Up Design and Material SelectionDownArrow
Sub-topics Covered
  • PCB substrate materials and dielectric properties (FR4, Rogers, etc.)
  • Controlled impedance and its dependence on stack-up geometry
  • Layer stack-up planning for signal, power, and ground planes
  • Role of reference planes in noise and EMI reduction
  • Designing multilayer boards for high-speed systems
  • Case study: optimal stack-up for a 6-layer DDR4 board
4. High-Speed Routing TechniquesDownArrow
Sub-topics Covered
  • Differential pair routing: principles and design rules
  • Length matching and timing skew compensation
  • Via design, stubs, and signal return paths
  • BGA fan-out and escape routing for dense designs
  • Routing constraints for DDR, PCIe, USB, and Ethernet
  • Simulation-based verification of routing performance
5. Power Integrity and Decoupling DesignDownArrow
Sub-topics Covered
  • Understanding power distribution networks (PDN)
  • Decoupling capacitor selection, placement, and optimization
  • Analyzing voltage droop and power rail noise
  • Grounding strategies and current return management
  • PDN impedance measurement and simulation
  • Case study: designing low-noise power delivery for FPGA systems
6. High-Speed Interfaces and Design ConstraintsDownArrow
Sub-topics Covered
  • Overview of high-speed standards: DDR, PCIe, HDMI, USB, SATA
  • Timing, clocking, and synchronization requirements
  • Equalization and pre-emphasis for long trace compensation
  • Eye diagram interpretation and compliance validation
  • Differential pair skew tuning for interface compliance
  • Real-world design examples and layout considerations
7. EMI/EMC Control and ShieldingDownArrow
Sub-topics Covered
  • Root causes of EMI and coupling mechanisms in PCBs
  • Ground plane segmentation and layout partitioning
  • Shielding techniques and guard trace implementation
  • Common-mode choke and filtering applications
  • Design rules for minimizing radiated and conducted emissions
  • Pre-compliance EMI/EMC testing and layout corrections
8. Thermal Design and ReliabilityDownArrow
Sub-topics Covered
  • Heat generation in high-speed and dense PCBs
  • Thermal vias, copper fills, and heat spreading strategies
  • Material selection and thermal coefficient management
  • Thermal simulation and analysis techniques
  • Reliability under temperature cycling and aging
  • Designing for manufacturability and rework resilience
9. Design Validation and SimulationDownArrow
Sub-topics Covered
  • Pre-layout and post-layout simulation workflows
  • Signal integrity and power integrity simulation setup
  • Crosstalk, eye diagram, and timing verification
  • Using IBIS and SPICE models for simulation accuracy
  • Correlation between simulation and lab measurements
  • Common pitfalls in validation and how to avoid them
10. Production, Testing, and Industry ReadinessDownArrow
Sub-topics Covered
  • DFM (Design for Manufacturability) and DFA (Design for Assembly) best practices
  • Generating Gerber, ODB++, and manufacturing documentation
  • PCB fabrication tolerances and quality checks
  • In-circuit testing (ICT) and boundary-scan design preparation
  • Design reviews, release process, and ECO management
  • Case studies: production of a high-speed board from concept to final test

Mentors

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15+ Years, Sr. Advanced Hardware & PCB Systems Architect, Ex-Cadence

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20+ Years, Staff Package co-design Engineer, Ex-ARM

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Tech Lead, 15+ Years, Qualcomm

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Course Includes

course includes

LIVE Interactive Sessions

course includes

Quizzes, Assignments & Projects

course includes

Study Materials & Session Recordings

course includes

Certificate

Tools Covered

tool

Course Includes

course includes

LIVE Interactive Sessions

course includes

Quizzes, Assignments & Projects

course includes

Study Materials & Session Recordings

course includes

Certificate

Course Pre-requisites

  • pre-requisiteSolid understanding of electronic circuits, components, and basic electromagnetic theory
  • pre-requisiteFamiliarity with schematic capture and PCB layout fundamentals
  • pre-requisiteWorking knowledge of digital and analog signal concepts
  • pre-requisiteBasic experience with at least one EDA tool (e.g., Altium Designer, KiCad, or Cadence)

Outcomes

  • skillsDesign multi-layer PCB stack-ups optimized for high-speed digital and mixed-signal applications
  • skillsImplement signal integrity analysis including impedance control, crosstalk mitigation, and transmission line design
  • skillsBuild power distribution networks (PDN) ensuring clean and stable power delivery across complex boards
  • skillsAnalyse EMI/EMC challenges and apply shielding, grounding, and filtering techniques to meet compliance standards
  • skillsDesign high-speed differential pair routing for protocols such as DDR4, PCIe, and Ethernet
  • skillsImplement DFM (Design for Manufacturing) and DFT (Design for Test) principles to ensure producibility and testability
  • skillsValidate PCB designs through pre-layout and post-layout simulation workflows using industry-standard tools
  • skillsCreate manufacturing-ready documentation including Gerber files, assembly drawings, and BOM management

Projects You Will Build

Practical, enterprise-grade projects that reflect real industry challenges

01

High-Speed DDR4 Memory Board Design

Design a multi-layer DDR4 memory interface board for a server application, optimizing the PCB stack-up, impedance-controlled routing, and length matching to meet strict timing requirements. Perform signal integrity simulations to validate eye diagrams and crosstalk margins, then generate complete manufacturing-ready output files.

02

Automotive Ethernet Switch PCB with EMI/EMC Compliance

Develop a high-speed Ethernet switch PCB targeting automotive applications, incorporating EMI shielding techniques, controlled impedance routing, and robust thermal management strategies. Simulate the design for radiated and conducted emissions compliance, and apply DFM rules suitable for automotive-grade manufacturing standards.

03

FPGA-Based High-Performance Accelerator Board

Design a multi-layer FPGA accelerator board featuring high-speed serial interfaces (PCIe, LVDS), a carefully engineered power distribution network with decoupling strategies, and thermal analysis. Use pre-layout and post-layout simulation tools to verify power integrity and signal integrity, and produce a production-ready layout with full documentation.

background certification section

for successfully completing the 'High-Speed PCB Design Engineer' course conducted from 09 May 2026 to 20 Jun 2026

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CertificateImageMob

for successfully completing the 'High-Speed PCB Design Engineer' course conducted from 09 May 2026 to 20 Jun 2026

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Limited time$1998.00
$779.00
moneyback guarantee

100% Moneyback Guarantee

Limited time offer$1998.00$779.00
moneyback guarantee

100% Moneyback Guarantee

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Frequently Asked Questions

Everything you need to know about the course

1What prior experience do I need before enrolling in this course?
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You should have a solid understanding of electronic circuits and components, familiarity with reading schematics, basic knowledge of digital and analog signals, and ideally some introductory experience with a PCB design tool such as Altium Designer or KiCad.

2What key topics are covered in the curriculum?
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The curriculum covers multi-layer PCB stack-up design, signal integrity (impedance matching, crosstalk, transmission lines), power distribution network design, EMI/EMC mitigation techniques, high-speed differential pair routing for protocols like DDR4 and PCIe, DFM/DFT principles, and simulation-based design validation workflows.

3How much time should I commit per week to complete this program?
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This is a 6-week intensive micro-degree. You should expect to dedicate approximately 12-15 hours per week, including video lectures, hands-on lab exercises, simulation assignments, and project work with mentor feedback.

4What hands-on projects will I work on during the course?
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You will complete three industry-relevant projects: a DDR4 memory board design with signal integrity validation, an automotive Ethernet switch PCB focusing on EMI/EMC compliance, and an FPGA-based accelerator board with power integrity analysis. Each project involves simulation, layout, and manufacturing-ready documentation.

5How will this course impact my career in hardware or electronics engineering?
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Graduates are prepared for high-demand roles such as High-Speed PCB Design Engineer, Signal Integrity Engineer, Power Integrity Engineer, and EMI/EMC Specialist. The hands-on portfolio of projects and proficiency with industry-standard simulation and layout tools make you immediately valuable to employers in sectors like automotive, telecommunications, and data centers.

6What tools and technologies will I learn to use?
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You will gain hands-on experience with Altium Designer and Cadence Allegro for PCB layout, HyperLynx for signal and power integrity simulation, SPICE-based simulation for circuit-level analysis, and supporting tools for impedance calculation and stack-up planning. All tool workflows are integrated into the project-based curriculum.

7Micro Degree course is live or recorded?
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The Micro Degree course is an online LIVE course, where LIVE sessions will be conducted online on our Classroom platform. Prior to the start of the course, you'll receive preparatory material in the form of recorded content which can be access on the same platform.

8In what language will the course be taught?
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In this course instructors will use English language for teaching.

9How do I access the course details and learning material after registration?
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Upon successful registration, you will receive a confirmation email on your registered email ID. In this email you will receive login details for your newly created account on the Edyoda Classroom platform (https://classroom.edyoda.com). Additionally, you will receive a PDF guide containing step-by-step instructions on how to utilize the platform to access live sessions and learning materials.

10 Who are the instructors, and what is their experience?
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Our instructors are the industry experts with a minimum working experience of 10 years with a strong technical and teaching background. They bring industry knowledge and practical expertise to the course.

11Will there be assignments, assessments, or a final project in the course?
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Yes, the course includes online assignments, quizzes, and a final project to reinforce your learning and assess your proficiency in High-Speed PCB Design Engineer.

12Can I interact with instructors and fellow students during the course?
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Yes, you can interact with instructors and fellow students through discussion forums, live Q&A sessions. We encourage a supportive learning community.

13What is 100% moneyback guarantee?
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We offer a 100% money-back guarantee to ensure your complete satisfaction. If you're not satisfied, you can request a full refund within 3 days of purchase or before the second session, whichever comes earlier. Simply contact our support team(support@edyoda.com) with your purchase details, such as the order ID or email address, and share your reason for the refund. Requests made after 3 days or after the second session will not be eligible for a refund. There are no hidden charges, you will receive the full amount paid. Refunds are processed within 7–10 business days and credited back to your original payment method.

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