
MICRO DEGREE
High-Speed PCB Design Engineer
Become a Certified High-Speed PCB Design Engineer
100% LIVE Interactive Classes
Become a Certified High-Speed PCB Design Engineer

100% LIVE Interactive Classes
Reserve your spot today!
Basic Info
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Application closes on:21 Jun 2026
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What is in it for you?
100% Live Classes
Instructor-led Live Sessions
Attend 4 weeks of instructor led live classes from the top 1% industry experts
Projects & Case Studies
Projects & Case Studies
Gain hands-on experience with projects and real-world case studies for impactful learning.
Verified Certificate
Verified Certificate
Earn a industry recognized certificate and kick start your career
Session Recordings
Session Recordings
Revisit older chapters anytime with recorded sessions
Flexible Schedule
Flexible Schedule
Choose live classes from different cohorts that fit your availability.
Hands-on Classes
Hands-on Classes
Hands-on classes to enhance your learning experience
100% Moneyback Guarantee
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Reserve your spot today!
Basic Info
Select Offers
Application closes on:21 Jun 2026
Get instant access of pre-course material!
Talk to Us
We’re here to help! Reach us at:
Learn from Top 1%
Sr. Managers, VPs, CXOs, Directors & Founders from companies shaping the future.

Combo Offers
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Available in 4 monthly installments at $195/month
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Curriculum
Duration: 6 weeks
Max Batch Size: 15 persons
Live Sessions Schedule
Sat - Sun (Weekends Only)
Timing 7:00 AM - 9:00 AM / 8:30 AM - 10:30 AM / 11:00 AM - 1:00 PM / 5:00 PM - 7:00 PM / 7:30 PM - 9:30 PM EST
- Evolution of high-speed digital systems and PCB requirements
- Differences between standard and high-speed board design
- Understanding signal integrity, timing, and noise challenges
- Overview of design flow: schematic to layout to validation
- Tools used in high-speed design (Altium, Cadence, KiCad, HyperLynx)
- Industry applications: computing, networking, automotive, and AI hardware
- Transmission line theory and wave propagation
- Reflections, crosstalk, and ringing in high-speed traces
- Impedance control and differential pair concepts
- Termination techniques and signal damping strategies
- Eye diagrams, timing windows, and jitter analysis
- Simulating signal integrity using SI tools and models
- PCB substrate materials and dielectric properties (FR4, Rogers, etc.)
- Controlled impedance and its dependence on stack-up geometry
- Layer stack-up planning for signal, power, and ground planes
- Role of reference planes in noise and EMI reduction
- Designing multilayer boards for high-speed systems
- Case study: optimal stack-up for a 6-layer DDR4 board
- Differential pair routing: principles and design rules
- Length matching and timing skew compensation
- Via design, stubs, and signal return paths
- BGA fan-out and escape routing for dense designs
- Routing constraints for DDR, PCIe, USB, and Ethernet
- Simulation-based verification of routing performance
- Understanding power distribution networks (PDN)
- Decoupling capacitor selection, placement, and optimization
- Analyzing voltage droop and power rail noise
- Grounding strategies and current return management
- PDN impedance measurement and simulation
- Case study: designing low-noise power delivery for FPGA systems
- Overview of high-speed standards: DDR, PCIe, HDMI, USB, SATA
- Timing, clocking, and synchronization requirements
- Equalization and pre-emphasis for long trace compensation
- Eye diagram interpretation and compliance validation
- Differential pair skew tuning for interface compliance
- Real-world design examples and layout considerations
- Root causes of EMI and coupling mechanisms in PCBs
- Ground plane segmentation and layout partitioning
- Shielding techniques and guard trace implementation
- Common-mode choke and filtering applications
- Design rules for minimizing radiated and conducted emissions
- Pre-compliance EMI/EMC testing and layout corrections
- Heat generation in high-speed and dense PCBs
- Thermal vias, copper fills, and heat spreading strategies
- Material selection and thermal coefficient management
- Thermal simulation and analysis techniques
- Reliability under temperature cycling and aging
- Designing for manufacturability and rework resilience
- Pre-layout and post-layout simulation workflows
- Signal integrity and power integrity simulation setup
- Crosstalk, eye diagram, and timing verification
- Using IBIS and SPICE models for simulation accuracy
- Correlation between simulation and lab measurements
- Common pitfalls in validation and how to avoid them
- DFM (Design for Manufacturability) and DFA (Design for Assembly) best practices
- Generating Gerber, ODB++, and manufacturing documentation
- PCB fabrication tolerances and quality checks
- In-circuit testing (ICT) and boundary-scan design preparation
- Design reviews, release process, and ECO management
- Case studies: production of a high-speed board from concept to final test
Mentors

15+ Years, Sr. Advanced Hardware & PCB Systems Architect, Ex-Cadence

20+ Years, Staff Package co-design Engineer, Ex-ARM

Tech Lead, 15+ Years, Qualcomm
Course Includes

LIVE Interactive Sessions

Quizzes, Assignments & Projects

Study Materials & Session Recordings

Certificate
Tools Covered
Course Includes

LIVE Interactive Sessions

Quizzes, Assignments & Projects

Study Materials & Session Recordings

Certificate
Course Pre-requisites
Solid understanding of electronic circuits, components, and basic electromagnetic theory
Familiarity with schematic capture and PCB layout fundamentals
Working knowledge of digital and analog signal concepts
Basic experience with at least one EDA tool (e.g., Altium Designer, KiCad, or Cadence)
Outcomes
Design multi-layer PCB stack-ups optimized for high-speed digital and mixed-signal applications
Implement signal integrity analysis including impedance control, crosstalk mitigation, and transmission line design
Build power distribution networks (PDN) ensuring clean and stable power delivery across complex boards
Analyse EMI/EMC challenges and apply shielding, grounding, and filtering techniques to meet compliance standards
Design high-speed differential pair routing for protocols such as DDR4, PCIe, and Ethernet
Implement DFM (Design for Manufacturing) and DFT (Design for Test) principles to ensure producibility and testability
Validate PCB designs through pre-layout and post-layout simulation workflows using industry-standard tools
Create manufacturing-ready documentation including Gerber files, assembly drawings, and BOM management
Projects You Will Build
Practical, enterprise-grade projects that reflect real industry challenges
High-Speed DDR4 Memory Board Design
Design a multi-layer DDR4 memory interface board for a server application, optimizing the PCB stack-up, impedance-controlled routing, and length matching to meet strict timing requirements. Perform signal integrity simulations to validate eye diagrams and crosstalk margins, then generate complete manufacturing-ready output files.
Automotive Ethernet Switch PCB with EMI/EMC Compliance
Develop a high-speed Ethernet switch PCB targeting automotive applications, incorporating EMI shielding techniques, controlled impedance routing, and robust thermal management strategies. Simulate the design for radiated and conducted emissions compliance, and apply DFM rules suitable for automotive-grade manufacturing standards.
FPGA-Based High-Performance Accelerator Board
Design a multi-layer FPGA accelerator board featuring high-speed serial interfaces (PCIe, LVDS), a carefully engineered power distribution network with decoupling strategies, and thermal analysis. Use pre-layout and post-layout simulation tools to verify power integrity and signal integrity, and produce a production-ready layout with full documentation.

for successfully completing the 'High-Speed PCB Design Engineer' course conducted from 09 May 2026 to 20 Jun 2026
Add a Industry Recognized
Certificate To Your Resume
Industry Recognized
Certificate
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Career Advancements
Elevate your career with a respected certificate

Industry Respect
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Networking
Connect with experts and peers

Opportunities
Attract exciting job prospects and promotions


for successfully completing the 'High-Speed PCB Design Engineer' course conducted from 09 May 2026 to 20 Jun 2026

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Frequently Asked Questions
Everything you need to know about the course
You should have a solid understanding of electronic circuits and components, familiarity with reading schematics, basic knowledge of digital and analog signals, and ideally some introductory experience with a PCB design tool such as Altium Designer or KiCad.
The curriculum covers multi-layer PCB stack-up design, signal integrity (impedance matching, crosstalk, transmission lines), power distribution network design, EMI/EMC mitigation techniques, high-speed differential pair routing for protocols like DDR4 and PCIe, DFM/DFT principles, and simulation-based design validation workflows.
This is a 6-week intensive micro-degree. You should expect to dedicate approximately 12-15 hours per week, including video lectures, hands-on lab exercises, simulation assignments, and project work with mentor feedback.
You will complete three industry-relevant projects: a DDR4 memory board design with signal integrity validation, an automotive Ethernet switch PCB focusing on EMI/EMC compliance, and an FPGA-based accelerator board with power integrity analysis. Each project involves simulation, layout, and manufacturing-ready documentation.
Graduates are prepared for high-demand roles such as High-Speed PCB Design Engineer, Signal Integrity Engineer, Power Integrity Engineer, and EMI/EMC Specialist. The hands-on portfolio of projects and proficiency with industry-standard simulation and layout tools make you immediately valuable to employers in sectors like automotive, telecommunications, and data centers.
You will gain hands-on experience with Altium Designer and Cadence Allegro for PCB layout, HyperLynx for signal and power integrity simulation, SPICE-based simulation for circuit-level analysis, and supporting tools for impedance calculation and stack-up planning. All tool workflows are integrated into the project-based curriculum.
The Micro Degree course is an online LIVE course, where LIVE sessions will be conducted online on our Classroom platform. Prior to the start of the course, you'll receive preparatory material in the form of recorded content which can be access on the same platform.
In this course instructors will use English language for teaching.
Upon successful registration, you will receive a confirmation email on your registered email ID. In this email you will receive login details for your newly created account on the Edyoda Classroom platform (https://classroom.edyoda.com). Additionally, you will receive a PDF guide containing step-by-step instructions on how to utilize the platform to access live sessions and learning materials.
Our instructors are the industry experts with a minimum working experience of 10 years with a strong technical and teaching background. They bring industry knowledge and practical expertise to the course.
Yes, the course includes online assignments, quizzes, and a final project to reinforce your learning and assess your proficiency in High-Speed PCB Design Engineer.
Yes, you can interact with instructors and fellow students through discussion forums, live Q&A sessions. We encourage a supportive learning community.
We offer a 100% money-back guarantee to ensure your complete satisfaction. If you're not satisfied, you can request a full refund within 3 days of purchase or before the second session, whichever comes earlier. Simply contact our support team(support@edyoda.com) with your purchase details, such as the order ID or email address, and share your reason for the refund. Requests made after 3 days or after the second session will not be eligible for a refund. There are no hidden charges, you will receive the full amount paid. Refunds are processed within 7–10 business days and credited back to your original payment method.
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